Positive photoresists

Positive Photoresist Series FP-9120:

FP-9120-1, FP-9120-1.8, FP-9120-2

This series of positive photoresists is intended for application as protective light-sensitive material in precision photolithographic processes used for fabrication of semiconductor devices, integrated circuits, metal masks, grids, printed circuit boards.

Any modification, ensuring formation of 0,5-2,5 μm film thickness, can be delivered on the consumer order.

For the photolithography on the relief substrates with the high reflection the photoresist coloured form (FP-9120-2C) can be delivered.

Developer – aqueous solution of KOH

Product parameters FP-9120-1 FP-9120-1,8 FP-9120-2
1 Kinematic viscosity, mm2/s 13-17 26-29 29-34
2 Filterability, g-1, not over 0,010 0,010 -
3 Resolution, µm 1 1 2
4 Film thickness range (3000 rpm, 30 s), μm 1,1-1,3 1,7-1,9 1,9-2,3
5 Unexposed film stability in the developer, min, not less 30 45 50
6 Developed relief thermostability 125-130°C


Positive resist FP-2550

The photoresist is designed for applications where coating thicknesses above 3 μm are required.

Any modification, ensuring formation of 3,5-10 μm photoresist film thickness, can be delivered on the consumer order.

Developer – aqueous solution of KOH

Product parameters

Kinematic viscosity, mm2/s 50-80
Resolution, µm 20
Film thickness range (3000 rpm, 30 s), μm 5,0-7,0
Unexposed film stability in the developer, min, not less 20


Positive resist FP-3515

The photoresist is intended for application as protective light-sensitive material in precision photolithographic processes used for fabrication of semiconductor devices and integrated circuits.

Developer – aqueous solution of KOH

Product parameters

Kinematic viscosity, mm2/s 20,0-24,0
Filterability, g-1, not over 0,010
Resolution, µm 1
Film thickness range (3000 rpm, 30 s), μm 1,4-1,6
Unexposed film stability in the developer, min, not less 5,0
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