Positive photoresists

Positive Photoresist Series FP-9120:

FP-9120-1, FP-9120-1.8, FP-9120-2

This series of positive photoresists is intended for application as protective light-sensitive material in precision photolithographic processes used for fabrication of semiconductor devices, integrated circuits, metal masks, grids, printed circuit boards.

Any modification, ensuring formation of 0,5-2,5 μm film thickness, can be delivered on the consumer order.

For the photolithography on the relief substrates with the high reflection the photoresist coloured form (FP-9120-2C) can be delivered.

Developer – aqueous solution of KOH

Product parameters		FP-9120-1	FP-9120-1,8	FP-9120-2
1	Kinematic viscosity, mm2/s	13-17	26-29	29-34
2	Filterability, g-1, not over	0,010	0,010	-
3	Resolution, µm	1	1	2
4	Film thickness range (3000 rpm, 30 s), μm	1,1-1,3	1,7-1,9	1,9-2,3
5	Unexposed film stability in the developer, min, not less	30	45	50
6	Developed relief thermostability	125-130°C

Positive resist FP-2550

The photoresist is designed for applications where coating thicknesses above 3 μm are required.

Any modification, ensuring formation of 3,5-10 μm photoresist film thickness, can be delivered on the consumer order.

Developer – aqueous solution of KOH

Product parameters

Kinematic viscosity, mm2/s	50-80
Resolution, µm	20
Film thickness range (3000 rpm, 30 s), μm	5,0-7,0
Unexposed film stability in the developer, min, not less	20

Positive resist FP-3515

The photoresist is intended for application as protective light-sensitive material in precision photolithographic processes used for fabrication of semiconductor devices and integrated circuits.

Developer – aqueous solution of KOH

Product parameters

Kinematic viscosity, mm2/s	20,0-24,0
Filterability, g-1, not over	0,010
Resolution, µm	1
Film thickness range (3000 rpm, 30 s), μm	1,4-1,6
Unexposed film stability in the developer, min, not less	5,0